DocumentCode :
710617
Title :
PPB: Partially-working processors binning for maximizing wafer utilization
Author :
Da Cheng ; Gupta, Sandeep K.
Author_Institution :
Xilinx, Inc., San Jose, CA, USA
fYear :
2015
fDate :
27-29 April 2015
Firstpage :
1
Lastpage :
6
Abstract :
Hardware redundancy, such as spare processors and cores, has been added to chip multi-processors (CMPs) to improve yield while sustaining all functionalities of CMPs. During post-silicon testing, spares processors and cores are used for repair. Even after repair, some CMPs may have processors with insufficient number of cores; in such CMPs some processors are disabled and such chips are sold at lower prices to improve yield per area. Despite binning on the number of processors, substantial functional resources are wasted in disabled components. In this work, we propose a new utility function and a new repair algorithm which enable utilization of every working core on a CMP. We demonstrate the benefits of the proposed approach for benchmarks from ISPASS and Nvidia CUDA SDK using GPGPU-sim to compute the instructions per cycle (IPC). Results show that our design and repair approaches provide above 50% IPC per wafer area even with 10x the current defect density.
Keywords :
graphics processing units; multiprocessing systems; parallel architectures; CMP; GPGPU-sim; IPC; ISPASS; Nvidia CUDA SDK; PPB; chip multiprocessors; current defect density; disabled components; hardware redundancy; instructions per cycle; partially-working processors binning; post-silicon testing; repair algorithm; spare processors; substantial functional resources; utility function; wafer area; wafer utilization maximization; Benchmark testing; Graphics processing units; Instruction sets; Maintenance engineering; Parallel processing; Redundancy; CMP; defect; hardware redundancy; yield;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Test Symposium (VTS), 2015 IEEE 33rd
Conference_Location :
Napa, CA
Type :
conf
DOI :
10.1109/VTS.2015.7116253
Filename :
7116253
Link To Document :
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