DocumentCode
710624
Title
3D microelectronic with BEOL compatible devices
Author
Drouin, D. ; A-Bounouar, M. ; Droulers, G. ; Labalette, M. ; Pioro-Ladriere, M. ; Souifi, A. ; Ecoffey, S.
Author_Institution
Lab. Nanotechnol. Nanosystemes (LN2), Univ. de Sherbrooke, Sherbrooke, QC, Canada
fYear
2015
fDate
27-29 April 2015
Firstpage
1
Lastpage
1
Abstract
This presentation will address the potential of nanoelectronic devices 3D monolithic integration in the CMOS back-end-of-line (BEOL) to add functionality and enhance integrated circuits (ICs) performances.
Keywords
CMOS integrated circuits; nanoelectronics; three-dimensional integrated circuits; 3D microelectronic; 3D monolithic integration; BEOL compatible devices; CMOS back-end-of-line; integrated circuits; nanoelectronic devices; CMOS integrated circuits; Circuit synthesis; Logic gates; Microelectronics; Nanoscale devices; Performance evaluation; Three-dimensional displays; 3D integration; nanoelectronics; resistive RAM; single electron transistor; tunneling transistor;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2015 IEEE 33rd
Conference_Location
Napa, CA
Type
conf
DOI
10.1109/VTS.2015.7116262
Filename
7116262
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