DocumentCode :
711005
Title :
Accurate 3‐D capacitance extractions for advanced nanometer CMOS nodes
Author :
Keh-Jeng Chang ; Shih-Hao Lee ; Kuo-Fu Lee ; Ping-Hung Yuh ; Ho-Che Yu ; Wen-Cheng Huang ; Chang, Victor C. Y.
Author_Institution :
R&D, Taiwan Semicond. Manuf. Co., Taiwan
fYear :
2015
fDate :
27-29 April 2015
Firstpage :
1
Lastpage :
4
Abstract :
During the R&D of advanced nanometer CMOS technologies such as 20nm and beyond, we implemented in-house 3-D capacitance extraction software to provide R&D engineers with an accurate modeling tool to optimize the complex 3-D nanometer dimensions and materials that may be used for competitive CMOS devices in terms of power consumption, performance, and area. Our extractor solves 3-D Laplace´s equation and extracts capacitances and resistances targeting accurate on-chip parasitic modeling. In essence, the numerical method we adopted features flexible grids for arbitrary shapes in nanometer CMOS devices. Robust and rigorous algorithms are described that allow the R&D engineers to monitor the convergence and specify the corresponding accuracy level based on the resource and allowed turnaround time.
Keywords :
CMOS integrated circuits; Laplace equations; integrated circuit modelling; nanoelectronics; numerical analysis; three-dimensional integrated circuits; 3D Laplace equation; advanced nanometer CMOS nodes; complex 3D nanometer dimensions; feature flexible grids; in-house 3D capacitance extraction software; numerical method; on-chip parasitic modeling; power consumption; size 20 nm; CMOS integrated circuits; Capacitance; Conductors; Finite element analysis; Mathematical model; Numerical models; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Application (VLSI-TSA), 2015 International Symposium on
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/VLSI-TSA.2015.7117550
Filename :
7117550
Link To Document :
بازگشت