Title :
Characterization of printed circuit board materials & manufacturing technologies for high frequency applications up to 110 GHz
Author :
Huber, Oliver ; Faseth, Thomas ; Arthaber, Holger ; Schlaffer, Erich
Author_Institution :
Inst. of Electrodynamics, Vienna Univ. of Technol., Vienna, Austria
Abstract :
This paper focuses on the description of loss behavior up to 110 GHz for two commercially widely used transmission line modes, microstrip (MS) and conductor backed coplanar waveguide (CBCPW). Within this investigation special attention has been drawn to the applied manufacturing processes as each process has distinct tolerances and etching behavior. The measured data is based on a comparison of 50 Ω transmission lines manufactured on two different substrates and for two structuring processes, pattern plating and panel plating.
Keywords :
microstrip lines; millimetre wave circuits; printed circuit manufacture; conductor backed coplanar waveguide; etching behavior; high frequency applications; panel plating; pattern plating; printed circuit board manufacturing technologies; printed circuit board materials; process tolerance; structuring process; transmission line mode; transmission lines; Manufacturing; Nickel; Transmission line measurements; Manufacturing technology; copper loss; dielectric loss; loss measurement; microwave circuits; microwave propagation; passive circuits;
Conference_Titel :
Wireless and Microwave Technology Conference (WAMICON), 2015 IEEE 16th Annual
Conference_Location :
Cocoa Beach, FL
DOI :
10.1109/WAMICON.2015.7120406
