Title :
400-Gb/s operation of flip-chip interconnection EADFB laser array module
Author :
Kanazawa, Shigeru ; Fujisawa, Takeshi ; Takahata, Kiyoto ; Sanjoh, Hiroaki ; Iga, Ryuzo ; Ueda, Yuta ; Kobayashi, Wataru ; Ishii, Hiroyuki
Author_Institution :
NTT Device Innovation Center, NTT Corp., Atsugi, Japan
Abstract :
The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 × 50-Gb/s simultaneous operation.
Keywords :
distributed feedback lasers; electro-optical modulation; electroabsorption; flip-chip devices; optical interconnections; semiconductor laser arrays; 8-channel EADFB laser array module; bit rate 400 Gbit/s; clear eye opening; distance 10 km; electroabsorption modulator; flip-chip interconnection; low crosstalk; transmission; Arrays; Crosstalk; Flip-chip devices; Integrated circuit interconnections; Lasers; Modulation; Wires;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location :
Los Angeles, CA
