Title :
High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers
Author :
Xianshu Luo ; Yulian Cao ; Junfeng Song ; Xiaonan Hu ; Tsung-Yang Liow ; Mingbin Yu ; Qijie Wang ; Guo-Qiang Lo
Author_Institution :
Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore
Abstract :
We propose and demonstrate high-throughput multiple dies-to-wafer bonding method with up to 104 dies through temporary-bonding dies to handle wafer for batch processing. Various hybrid III/V-on-silicon lasers are demonstrated with CW operation at room temperature.
Keywords :
III-V semiconductors; elemental semiconductors; semiconductor lasers; silicon; wafer bonding; CW operation; III/V-on-Si hybrid lasers; Si; batch processing; high-throughput multiple dies-to-wafer bonding; temperature 293 K to 298 K; temporary-bonding dies; Bonding; Decision support systems; Germanium; Optical interconnections; Pump lasers; Semiconductor lasers; Silicon;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location :
Los Angeles, CA
