Title :
Device technologies for integrated packaged transceivers
Author :
Griffin, Robert A.
Author_Institution :
Oclaro Inc., USA
Abstract :
Summary form only given. InP-based PICs have enabled a first generation of CFP2-ACO modules for line-side 100Gb/s deployment. A number of options are available to scale to higher volumes and enable high density transport up to 400Gb/s.
Keywords :
indium compounds; optical transceivers; CFP2-ACO module; InP; InP-based PIC; bit rate 100 Gbit/s; integrated packaged transceiver; line-side deployment; Integrated optics; Optical devices; Transceivers;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location :
Los Angeles, CA
