• DocumentCode
    712678
  • Title

    Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

  • Author

    Barwicz, Tymon ; Taira, Yoichi ; Lichoulas, Ted W. ; Boyer, Nicolas ; Numata, Hidetoshi ; Martin, Yves ; Jae-Woong Nah ; Takenobu, Shotaro ; Janta-Polczynski, Alexander ; Kimbrell, Eddie L. ; Leidy, Robert ; Khater, Marwan ; Kamlapurkar, Swetha ; Engelman

  • Author_Institution
    IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2015
  • fDate
    22-26 March 2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.
  • Keywords
    assembling; electronics packaging; integrated circuits; assembly cost; cost-efficiency; high-throughput microelectronic assembly lines; microelectronic packaging facilities; optical port-count; photonic packaging; scalability; silicon photonic packaging; Assembly; Microelectronics; Optical fiber couplers; Packaging; Photonics; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communications Conference and Exhibition (OFC), 2015
  • Conference_Location
    Los Angeles, CA
  • Type

    conf

  • Filename
    7122056
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=712678