Title :
Embracing diversity: Interconnecting different materials and components for the lowest $/Gb
Author :
Pezeshki, Bardia
Author_Institution :
Kaiam Corp., Newark, CA, USA
Abstract :
Highest performance and lowest cost optical functions are best obtained in the shortest time by using proven and mature building blocks. We show the use of a MEMS breadboard to interconnect glass PLCs, InP lasers, and silicon photonics for a variety of functions.
Keywords :
III-V semiconductors; elemental semiconductors; indium compounds; integrated optics; integrated optoelectronics; micro-optomechanical devices; optical glass; optical transceivers; semiconductor lasers; silicon; InP; InP lasers; MEMS breadboard; Si; glass PLC; highest performance optical functions; lowest cost optical functions; microelectromechanical systems; planar lightwave circuit; silicon photonics; transceiver; Decision support systems;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location :
Los Angeles, CA
