DocumentCode :
712840
Title :
On the impact of carbon-doping on the dynamic Ron and off-state leakage current of 650V GaN power devices
Author :
Moens, P. ; Vanmeerbeek, P. ; Banerjee, A. ; Guo, J. ; Liu, C. ; Coppens, P. ; Salih, A. ; Tack, M. ; Caesar, M. ; Uren, M.J. ; Kuball, M. ; Meneghini, M. ; Meneghesso, G. ; Zanoni, E.
Author_Institution :
ON Semicond., Oudenaarde, Belgium
fYear :
2015
fDate :
10-14 May 2015
Firstpage :
37
Lastpage :
40
Abstract :
A strong positive correlation between dynamic Ron and the ionization of buffer traps by injection of electrons from the Si substrate is presented. By exploring different Carbon doping profiles in the epi layers, the substrate buffer leakage is substantially reduced, which in turns results in lower dynamic Ron. The traps in the epi structure are characterized by different electrical techniques such as drain current transient, on-the-fly trapping and ramped back-gating experiments.
Keywords :
III-V semiconductors; carbon; gallium compounds; power HEMT; power semiconductor devices; semiconductor doping; wide band gap semiconductors; GaN; buffer traps; carbon-doping; drain current transient; electrical techniques; electrons; leakage current; on-the-fly trapping; power devices; ramped back-gating; voltage 650 V; Aluminum gallium nitride; Charge carrier processes; Gallium nitride; HEMTs; Leakage currents; Silicon compounds; Substrates; AlGaN/GaN; Carbon; Dynamic Ron; HEMT; offstate leakage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
Conference_Location :
Hong Kong
ISSN :
1943-653X
Print_ISBN :
978-1-4799-6259-4
Type :
conf
DOI :
10.1109/ISPSD.2015.7123383
Filename :
7123383
Link To Document :
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