Title :
Multi-dimensional trade-off considerations of the 750V micro pattern trench IGBT for electric drive train applications
Author :
Wolter, Frank ; Roesner, Wolfgang ; Cotorogea, Maria ; Geinzer, Thomas ; Seider-Schmidt, Martina ; Kae-Horng Wang
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
Abstract :
The EDT2 750V uses a micro pattern trench cell with a narrow mesa for reducing the on-state losses with a tailored channel width for short circuit robustness. To account for high system stray inductances (Lstray) and currents for Full or Hybrid Electric Vehicle inverter applications, it features a 750V voltage rating compared to the predecessor IGBT3 650V by an optimized vertical structure and proper plasma shaping. This plasma distribution not only determines the performance tradeoff between on-state and switching losses, but at the same time defines the surge voltage for a given Lstray*I in the application as visualized in a switch-off loss vs. surge voltage trade-off diagram. Shaping of the feedback capacitance Cgc optimizes the tunability of the switching slopes by means of an external gate resistor for an easier adaption to a wider range of system inductances with low losses.
Keywords :
capacitance; electric drives; hybrid electric vehicles; inductance; insulated gate bipolar transistors; invertors; losses; surges; EDT2; electric drive train applications; external gate resistor; feedback capacitance shaping; high system stray currents; high system stray inductances; hybrid electric vehicle inverter applications; insulated gate bipolar transistors; micro pattern trench IGBT; multidimensional trade-off considerations; narrow mesa; on-state losses reduction; plasma distribution; plasma shaping; predecessor IGBT3; short circuit robustness; surge voltage trade-off diagram; switch-off loss; switching slope tunability; tailored channel width; vertical structure optimization; voltage 650 V; voltage 750 V; voltage rating; Capacitance; Insulated gate bipolar transistors; Logic gates; Plasmas; Surges; Switches; Switching loss;
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4799-6259-4
DOI :
10.1109/ISPSD.2015.7123400