• DocumentCode
    712858
  • Title

    Superjunction IGBT vs. FS IGBT for 200°C operation

  • Author

    Hsieh, Alice Pei-Shan ; Camuso, Gianluca ; Udrea, Florin ; Chiu Ng ; Yi Tang ; Vytla, Rajeev Krishna ; Ranjan, Niraj ; Charles, Alain

  • Author_Institution
    Dept. of Eng., Univ. of Cambridge, Cambridge, UK
  • fYear
    2015
  • fDate
    10-14 May 2015
  • Firstpage
    137
  • Lastpage
    140
  • Abstract
    Adverse effects on the temperature-dependent properties of Insulated Gate Bipolar Transistors (IGBTs) are often observed when the junction temperature exceeds 175°C. It is believed that attempts in enabling the operation of IGBTs at 200°C will inevitably introduce penalties in some electrical properties of the device. Therefore, the trade-off relationship between the key parameters must be carefully considered. In this paper, we present for the first time that the Superjunction (SJ) IGBT can deliver the best performance trade-offs between the conduction and turn-off losses while maintaining low leakage current at 200°C when compared with other IGBTs. Moreover, the output and switching characteristics of SJ IGBTs depend on the SJ pillar geometry and the doping level of the SJ pillars. We discover that the structure with disconnected p-body and p-pillar with moderate pillar doping concentration (Dpn) is the key in achieving excellent turn-off behavior without sacrificing the on-state voltage drop (Von) at 200°C.
  • Keywords
    insulated gate bipolar transistors; FS IGBT; SJ IGBT; electrical properties; insulated gate bipolar transistors; on-state voltage drop; pillar doping concentration; superjunction IGBT; temperature 175 C; temperature 200 C; temperature-dependent properties; Benchmark testing; Doping; Geometry; Insulated gate bipolar transistors; Optimization; Performance evaluation; Standards; 200˚C operation; Field-Stop IGBT; Superjunction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
  • Conference_Location
    Hong Kong
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-6259-4
  • Type

    conf

  • DOI
    10.1109/ISPSD.2015.7123408
  • Filename
    7123408