• DocumentCode
    712868
  • Title

    Stability of silicon carbide Schottky diodes against leakage current thermal runaway

  • Author

    Bodeker, Christian ; Vogt, Timo ; Kaminski, Nando

  • Author_Institution
    Inst. for Electr. Drives, Power Electron., & Devices, Univ. of Bremen, Bremen, Germany
  • fYear
    2015
  • fDate
    10-14 May 2015
  • Firstpage
    245
  • Lastpage
    248
  • Abstract
    Thermal stability is mandatory for the application of power semiconductor devices. Thermal runaway as a consequence of the feedback loop of increasing temperature and increasing leakage current is one risk, especially for Schottky-diodes featuring particular blocking characteristics. In this work the blocking characteristics of modern SiC-Schottky diodes including MPS and JBS types were measured and the stability was investigated by means of theoretical considerations as well as measurements. Even the worst devices are thermally stable far beyond their datasheet limits and have to be mistreated to show thermal runaway. For the time being thermal runaway is, thus, not a limiting factor for the thermal design of SiC-diodes. However, when going to the much higher operating temperatures promised by SiC the picture looks quite different again.
  • Keywords
    Schottky diodes; leakage currents; power semiconductor diodes; silicon compounds; thermal stability; wide band gap semiconductors; JBS types; MPS types; Schottky diode stability; SiC; blocking characteristics; datasheet limits; feedback loop; leakage current thermal runaway; operating temperatures; power semiconductor devices; thermal stability design; Leakage currents; Schottky diodes; Silicon carbide; Stability criteria; Temperature measurement; Thermal stability; Schottky; SiC; Silicon Carbide; diode; leakage current; stability; thermal design; thermal runaway;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
  • Conference_Location
    Hong Kong
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-6259-4
  • Type

    conf

  • DOI
    10.1109/ISPSD.2015.7123435
  • Filename
    7123435