Title :
Improved-Power-Quality Bridgeless-Converter-Based Multiple-Output SMPS
Author :
Singh, Sushil ; Singh, Bawa ; Bhuvaneswari, G. ; Bist, Vashist ; Chandra, Aniruddha ; Al-Haddad, Kamal
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol. Delhi, New Delhi, India
Abstract :
This paper deals with the design, analysis, simulation, and development of a power-factor-correction (PFC) multiple-output switched-mode power supply (SMPS) using a bridgeless buck-boost converter at the front end. Single-phase ac supply is fed to a pair of back-to-back-connected buck-boost converters to eliminate the diode bridge rectifier, which results in reduction of conduction losses and power quality improvement at the front end. The operation of the bridgeless buck-boost converter in discontinuous conduction mode ensures inherent PFC operation and reduces complexity in control. The performance of the proposed multiple-output SMPS is evaluated under varying input voltages and loads by simulating this circuit in MATLAB/Simulink environment, and the results obtained through simulation are validated experimentally on a developed prototype. Both simulation and experimental results demonstrate the improved performance of the proposed SMPS.
Keywords :
power convertors; power factor correction; power supply quality; switched mode power supplies; back-to-back-connected buck-boost converters; bridgeless buck-boost converter; conduction losses; diode bridge rectifier; discontinuous conduction mode; improved-power-quality bridgeless-converter-based multiple-output SMPS; power quality improvement; power-factor-correction multiple-output switched-mode power supply; single-phase ac supply; Capacitors; Inductors; Power harmonic filters; Switched-mode power supply; Switches; Voltage control; Windings; Bridgeless buck???boost converter; discontinuous conduction mode (DCM); improved power quality; multiple-output switched-mode power supply (SMPS); power factor (PF) correction (PFC);
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2014.2331421