DocumentCode :
712997
Title :
Performance study of high-k gate & spacer dielectric Dopant Segregated Schottky Barrier SOI MOSFET
Author :
Banchhor, Sumit Kale Shashank ; Kondekar, P.N.
Author_Institution :
Electron. &Commun. Eng., PDPM IIITDM, Jabalpur, India
fYear :
2015
fDate :
26-27 Feb. 2015
Firstpage :
1142
Lastpage :
1145
Abstract :
In this paper, a comprehensive study on the performance of Dopant Segregated Schottky Barrier Silicon-on-Insulator (DSSB-SOI) MOSFETs with high-k (HfO2)gate & spacer dielectric is presented. High-k dielectric is extensively used for nanoscale device performance improvement, due to it sreduced off state leakage and enhanced electrostatic control over the channel. It has been found that, due to the presence of high-k dielectric, the major short channel device constraints subthreshold slope and off state leakage is reduced as compared to conventional DSSB SOI MOSFET having low-k(SiO2) gate and spacer dielectric. A strong impact of SOI thickness, channel length, on the performance of proposed DSSB SOI MOSFET are observed using SilvacoATLAS 2D device Simulator. The proposed device achieves higher Ion/Ioff (>105) &Ioff <; 1010A/μm.
Keywords :
MOSFET; Schottky barriers; dielectric materials; hafnium compounds; semiconductor doping; silicon-on-insulator; DSSB SOI MOSFET; HfO2; dopant segregated Schottky barrier silicon-on-insulator; electrostatic control; high-k gate dielectric; metal oxide semiconductor field effect transistor; off state leakage; short channel device constraint; spacer dielectric; subthreshold slope; Capacitance; Decision support systems; Dielectrics; Logic gates; MOSFET; Performance evaluation; Schottky barriers; Schottky barrier; dopant-segregation; high-k gate&spacer dielectric; off state leakage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and Communication Systems (ICECS), 2015 2nd International Conference on
Conference_Location :
Coimbatore
Print_ISBN :
978-1-4799-7224-1
Type :
conf
DOI :
10.1109/ECS.2015.7124762
Filename :
7124762
Link To Document :
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