Title :
Millimeter-wave radar systems on-chip and in package: Current status and future challenges
Author :
Feger, Reinhard ; Stelzer, Andreas
Author_Institution :
Inst. f. Comm. Eng. & RF-Sys., Johannes Kepler Univ., Linz, Austria
Abstract :
In this work, we give an overview on recent developments that have been made in the field of mm-wave systems which are integrated on chip or in package. Several aspects like waveforms and signal generation, multi-channel systems for beamforming applications as well as integration of antennas into packages will be discussed. The focus of this work is put on approaches which are suitable for on-chip and in-package integration. The restrictions imposed by the integration into single devices are discussed and several prototype systems are presented.
Keywords :
array signal processing; millimetre wave radar; radar antennas; radar signal processing; system-in-package; system-on-chip; antenna-package integration; beamforming application; millimeter-wave radar system-in-package; millimeter-wave radar system-on-chip; mm-wave systems; multichannel systems; signal generation; Radar antennas; Radar cross-sections; Radar imaging; Sensors; System-on-chip; Integrated circuit packaging; Millimeter-wave technology; Radar imaging;
Conference_Titel :
Wireless Sensors and Sensor Networks (WiSNet), 2015 IEEE Topical Conference on
Conference_Location :
San Diego, CA
DOI :
10.1109/WISNET.2015.7127407