• DocumentCode
    7149
  • Title

    Scale Modeling on the Overheat Failure of Bus Contacts in Gas-Insulated Switchgears

  • Author

    Hongtao Li ; Naiqiu Shu ; Xiaowen Wu ; Hui Peng ; Zipin Li

  • Author_Institution
    Sch. of Electr. Eng., Wuhan Univ., Wuhan, China
  • Volume
    50
  • Issue
    2
  • fYear
    2014
  • fDate
    Feb. 2014
  • Firstpage
    305
  • Lastpage
    308
  • Abstract
    This paper deals with the scale modeling method to investigate the overheat failure mechanism and the processes of bus contacts in gas-insulated switchgears (GIS). Mathematical models of the physical phenomenon in the overheat failure process are summarized to derive the coupled eddy current-fluid-heat field scaling relationships. In pursuit of better availability of the model, the scaling relationships are then simplified and a partial scale model is further designed with the dimension parameters, physical parameters, and boundary conditions presented. Temperature distributions and current densities of the scale model are compared with those of the prototype to verify the effectiveness of the scale model by 3-D finite-element method. The test scale model is fabricated, and the temperature rise tests are conducted to validate the correctness of the scale modeling and the simulation calculation.
  • Keywords
    eddy currents; finite element analysis; gas insulated switchgear; mathematical analysis; temperature distribution; 3-D finite-element method; GIS; bus contacts; coupled eddy current-fluid-heat field scaling relationships; current densities; dimension parameters; gas-insulated switchgears; mathematical models; overheat failure; overheat failure mechanism; overheat failure process; partial scale model; physical parameters; physical phenomenon; scale modeling; scale modeling method; simulation calculation; temperature distributions; temperature rise tests; Conductors; Contacts; Heat transfer; Mathematical model; Prototypes; Sulfur hexafluoride; Contact resistance; FEMs; equipment failure; solid modeling; thermal analysis;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2013.2281997
  • Filename
    6748998