DocumentCode :
715923
Title :
New drain current model for nano-meter MOS transistors on-chip threshold voltage test
Author :
Jinbo Wan ; Kerkhoff, Hans G.
Author_Institution :
Testable Design & Test of Integrated Syst. Group (TDT), Univ. of Twente, Enschede, Netherlands
fYear :
2015
fDate :
25-29 May 2015
Firstpage :
1
Lastpage :
6
Abstract :
Traditional reliability tests use complicated equipment, like probe stations and semiconductor parameter analyzers, to measure changes in transistors´ threshold voltages, which are both expensive and time consuming. This paper provides an idea to test the threshold voltage with existing low-to-moderate accuracy ADCs and DACs inside SoCs. To avoid the low-accuracy limitation of measurement results, a new MOS model for the nano-meter MOS transistor drain current is proposed. This model only uses six parameters and is valid for all regimes, being the sub-threshold/weak-inversion, moderate-inversion, strong-inversion and linear regime. Measurement results from 90nm transistors and simulation results from 65nm BSIM4.6 models are used to validate the new model. Finally, an on-chip threshold test for reliability purpose is proposed and long-time stress measurement for 90nm PMOS transistors are shown.
Keywords :
power MOSFET; semiconductor device measurement; semiconductor device models; semiconductor device reliability; semiconductor device testing; stress measurement; system-on-chip; ADC; DAC; PMOS transistors; SoC; drain current model; long-time stress measurement; nano-meter MOS transistors on-chip threshold voltage test; size 65 nm; size 90 nm; Accuracy; Current measurement; MOSFET; Semiconductor device measurement; System-on-chip; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Symposium (ETS), 2015 20th IEEE European
Conference_Location :
Cluj-Napoca
Type :
conf
DOI :
10.1109/ETS.2015.7138751
Filename :
7138751
Link To Document :
بازگشت