• DocumentCode
    716962
  • Title

    Transceiver chip design in high voltage 0.25µm CMOS technology for magnetic resonance system

  • Author

    Heng-Ming Hsu ; Chun-Tsai Chien ; Dien-Ying Wu

  • Author_Institution
    Dept. of Electr. Eng., Nat. Chung-Hsing Univ., Taichung, Taiwan
  • fYear
    2015
  • fDate
    13-15 May 2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A transceiver IC chip of wireless power transfer is design for wearable device application. The chip forced a VDD of 24V is operated at 11MHz clock rate. The non-overlap clock technique is adopted in chip design for improving the efficiency. To verify the proposed circuit, the chip is implemented by TSMC High Voltage 0.25μm CMOS technology. The testing board is design to measure the IC chip. The driver chip dissipates 23.48W from DC source and deliver a power of 22.73W to 22Ω load. Therefore, the IC chip efficiency is 92.3%. The magnetic resonance coil is design to test the IC chip. The measurement S21 peak is occurred at 5.5MHz in resonance coil.
  • Keywords
    CMOS integrated circuits; inductive power transmission; integrated circuit design; magnetic resonance; transceivers; TSMC high voltage CMOS technology; clock technique; frequency 11 MHz; magnetic resonance system; power 22.73 W; power 23.48 W; size 0.25 mum; transceiver IC chip; transceiver chip design; voltage 24 V; wearable device application; wireless power transfer; Couplings; Integrated circuits; Magnetic resonance; Semiconductor device measurement; Testing; Transceivers; Wireless communication; IC chip; Magnetic resonance coupling; transceiver; wearable device; wireless power transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Power Transfer Conference (WPTC), 2015 IEEE
  • Conference_Location
    Boulder, CO
  • Type

    conf

  • DOI
    10.1109/WPT.2015.7140164
  • Filename
    7140164