Title :
Encapsulated Copper Wire and Copper Mesh Capacitive Sensing for 3-D Printing Applications
Author :
Shemelya, Corey ; Cedillos, Fernando ; Aguilera, E. ; Espalin, David ; Muse, Danny ; Wicker, Ryan ; MacDonald, Eric
Author_Institution :
W.M. Keck Center for 3D Innovation, Univ. of Texas at El Paso, El Paso, TX, USA
Abstract :
Advances in the field of extrusion based 3-D printing have recently allowed the incorporation of embedded electronics and interconnects, in order to increase the functionality of these structures. This paper builds on previous work in the area of fine-pitch copper mesh and embedded copper wire capacitive sensors encapsulated within a 3-D printed structure. Three varieties of sensors were fabricated and tested, including a small area wire sensor (320-μm width), a large area mesh sensor (2 cm2), and a fully embedded demonstration model. In order to test and characterize these sensors, three distinct tests were explored. Specifically, the capacitive sensors were able to distinguish between three metallic materials and distinguish salt water from distilled water. These capacitive sensors have many potential sensing applications, such as biomedical sensing, human interface devices, material sensing, electronics characterization, and environmental sensing. As such, this paper also characterizes the capacitive sensors for an active microfluidic mixer.
Keywords :
capacitive sensors; copper; encapsulation; printing; wires; 3-D printing applications; Cu; capacitive sensing; distilled water; embedded copper wire; encapsulated copper wire; fine-pitch copper mesh; fully embedded demonstration model; large area mesh sensor; metallic materials; salt water; size 320 mum; small area wire sensor; Capacitive sensors; Copper; Microfluidics; Sensor phenomena and characterization; Three-dimensional displays; Wires; 3D printing; capacitive sensing; embedded sensors;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2014.2356973