DocumentCode :
718313
Title :
Mechanically adaptive materials for intracortical implants
Author :
Jorfi, Mehdi ; Potter, Kelsey A. ; Nguyen, Jessica K. ; Hess-Dunning, Allison E. ; Foster, E. Johan ; Capadona, Jeffrey R. ; Weder, Christoph
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2015
fDate :
22-24 April 2015
Firstpage :
601
Lastpage :
602
Abstract :
Cortical microelectrodes allow electrical contacts with neural cells and show promise as electrical interfaces to the brain, which allow for the treatment of several neurological deficits. However, the functionality of current electrodes decreases over time, in part due to neuron degeneration and foreign body encapsulation. One hypothesis is that the mismatch of the mechanical properties of the electrode and the brain tissue is a significant contributor to these events. We recently developed a new approach to chemically responsive, mechanically adaptive polymer nanocomposites, which are initially highly rigid, but soften considerably upon exposure to physiological conditions and aqueous environments in general. Initial in-vivo experiments suggest that the materials promise to be a useful platform for the design of next-generation intracortical devices.
Keywords :
bioelectric phenomena; biological tissues; biomedical materials; brain; cellular biophysics; filled polymers; microelectrodes; nanocomposites; nanomechanics; nanomedicine; neurophysiology; prosthetics; aqueous environments; brain tissue; chemical responsive mechanical adaptive polymer nanocomposites; cortical microelectrodes; electrical contacts; electrical interfaces; foreign body encapsulation; in-vivo experiments; intracortical implants; mechanical adaptive materials; mechanical properties; neural cells; neurological deficit treatment; neuron degeneration; next-generation intracortical devices; physiological conditions; Drugs; Electrodes; Electronic mail; Implants; Nanocomposites; Physiology; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Neural Engineering (NER), 2015 7th International IEEE/EMBS Conference on
Conference_Location :
Montpellier
Type :
conf
DOI :
10.1109/NER.2015.7146694
Filename :
7146694
Link To Document :
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