DocumentCode
718840
Title
Finite element simulation of stress relaxation process in living cells
Author
Fanan Wei ; Peilin Zhou ; Guangyong Li ; Lianqing Liu
Author_Institution
State Key Lab. of Robot., Shenyang Inst. of Autom., Shenyang, China
fYear
2015
fDate
7-11 April 2015
Firstpage
67
Lastpage
71
Abstract
In this manuscript, we investigated the fundamental mechanism of stress relaxation phenomenon by employing finite element simulation. Through finite element simulations, the evolution of stress distribution, deformation field and the interaction force was wholly recorded during both the loading and stress relaxation stages. With the developed simulation model, the sensitivity of force-time curves on cell height and substrate stiffness was thoroughly studied by changing the thickness of cell and Young´s modulus of the substrate. The simulation results indicated that the variation of cell height leads to the significant change of F-t curve´s magnitude but tiny deviation of the curve´s shape. And the influence originates from the substrate can be totally eliminated with relatively hard substrate. Finally, using the viscoelastic parameters extracted from actual stress relaxation experiment, the dynamic mechanical behavior of L929 cells is simulated and investigated. A comparison between the experimental and simulation F-t curves demonstrated the effectiveness of the proposed finite element simulation approach.
Keywords
Young´s modulus; biomechanics; cellular biophysics; deformation; elasticity; finite element analysis; stress analysis; Young modulus; cell height variation; cell thickness; deformation field; dynamic mechanical behavior; finite element simulation approach; force-time curve sensitivity; stress distribution evolution; stress relaxation process; substrate stiffness; Atomic force microscopy; Finite element analysis; Force; Probes; Stress; Substrates; Cell mechanics; Finite element simulation; Viscoelastic;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location
Xi´an
Type
conf
DOI
10.1109/NEMS.2015.7147375
Filename
7147375
Link To Document