DocumentCode :
718910
Title :
Failure of a MEMS switch after environmental test
Author :
Ding Xuran ; Feng Yue ; Lou Wenzhong ; Guo Yunlong
Author_Institution :
Nat. Key Lab. of Electro-Mech. Eng. & Control, Beijing Inst. of Technol., Beijing, China
fYear :
2015
fDate :
7-11 April 2015
Firstpage :
417
Lastpage :
420
Abstract :
A MEMS switch based on electro-thermal and electro-explosion has been packaged before its humidity test, temperature shock test and ballistic shock test are taken. Some devices failed after the tests. The analysis of such a device is given in this paper.
Keywords :
failure analysis; microswitches; semiconductor device reliability; semiconductor device testing; MEMS switch failure; ballistic shock test; electroexplosion; electrothermal; environmental test; humidity test; temperature shock test; Atmosphere; Electric shock; Humidity; Micromechanical devices; Microswitches; Resistance; MEMS switch; environmental test; failure;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location :
Xi´an
Type :
conf
DOI :
10.1109/NEMS.2015.7147457
Filename :
7147457
Link To Document :
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