Title :
A method to evaluate the influence of different substrate on stress mismatch induced deformation in MEMS accelerometer
Author :
Jun You ; Dayu Tian ; Chunhua He ; Qiancheng Zhao ; Zhenchuan Yang ; Dacheng Zhang ; Guizhen Yan
Author_Institution :
Shenzhen Grad. Sch., Peking Univ., Beijing, China
Abstract :
This paper presents a method to evaluate the influence of stress mismatch between sensor structure and different die-attachment on the thermal stability of accelerometers. The local deformation of MEMS accelerometers under different thermal load and differential die-attachment conditions are investigated. White light interferometer and a home-made heating stage are used to carry out the measurement. Capacitance variations of differential capacitors can be calculated based on the data of the local deformation of MEMS accelerometers. Both the visual evidences and calculated capacitance variations in this work can give clear guidance to optimize both the structural design and packaging conditions.
Keywords :
accelerometers; electronics packaging; light interferometers; microsensors; thermal stability; thermal stresses; MEMS accelerometer; capacitance variations; differential capacitors; differential die-attachment conditions; home-made heating stage; sensor structure; stress mismatch; thermal load; thermal stability; white light interferometer; Accelerometers; Capacitance; Capacitors; Ceramics; Loading; Substrates; Thermal loading; capacitance variation; deformation; packaging; structural design; temperature drift; thermal reliability;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location :
Xi´an
DOI :
10.1109/NEMS.2015.7147458
