The parametric analysis of the centrifugal insurance mechanism in MEMS safety and arming device

Author

Wang Fufu ; Lou Wenzhong ; Xiong Yongjia ; Liu Fangyi ; Wang Dakui ; Jin Xin ; Zhang Mingrong ; Xu Chenggang

Author_Institution

State Key Lab. of Mechatron. Eng. & Control, Beijing Inst. of Technol., Beijing, China

fYear

2015

fDate

7-11 April 2015

Firstpage

457

Lastpage

460

Abstract

In this paper, a MEMS S&A device has been proposed. The size of the device is φ 12×0.3mm. The role of the centrifugal insurance mechanism is to ensure the safety in handling transportation and storage, and reliable firing with the launch overload. Through establishing the three-dimensional model of the centrifugal insurance mechanism, establishing the force and the parameters of the centrifugal insurance mechanism, deriving the mathematical model according to the rigid dynamic mechanics theory and establishing the finite element model by using ANSYS/LS-DYNA, appropriate centrifugal insurance mechanism is designed to meet two items, one item is deformation of elastic beam can reliably release slider when the speed is more than 30000r/min and the centrifugal insurance mechanism can restrict the slider again when the speed is reduced; the other item is the centrifugal insurance mechanism can effectively restrict the slider to ensure the safety of the device when primary insurance accident arming in handling transportation.

Keywords

beams (structures); deformation; elasticity; finite element analysis; micromechanical devices; safety; storage; weapons; ANSYS/LS-DYNA; MEMS S&A device; MEMS safety; arming device; centrifugal insurance mechanism; elastic beam deformation; finite element model; mathematical model; parametric analysis; rigid dynamic mechanics theory; storage handling; three-dimensional model; transportation handling; Deformable models; Finite element analysis; Insurance; Mathematical model; Micromechanical devices; Safety; Transportation; MEMS; S&A Device; The Centrifugal Insurance Mechanism;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on

Conference_Location

Xi´an

Type

conf

DOI

10.1109/NEMS.2015.7147467

Filename

7147467