DocumentCode :
718922
Title :
Peeling condition analysis of biomimetic adhesive structure-A finite element study
Author :
Hung, C.Y. ; Sung, C.K.
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2015
fDate :
7-11 April 2015
Firstpage :
476
Lastpage :
480
Abstract :
Gecko and many insects have nanoscale fibrillary structures on their feet serving as adhesive devices. In recent years, van der Waals interaction has been proven to be the primary molecular origin for this kind of phenomena. However peeling zone and cohesive zone both play significant roles in peeling process while peeling zone can be described by van der Waals force, cohesive zone is dependent of molecular interaction. In this study, we consider the case of peeling of two elastic bodies, in which the pull-off force depends linearly on the cohesive stress and is independent of the work of adhesion. We simulate the adhesion interaction and peeling condition between a single biomimetic adhesive structure and a substrate, as a biomimetic axisymmetric geometries model, by encoding van der Waals force and molecular interaction in COMSOL software. The simulation takes theoretical fundamental equations as inputs, and by varying relative peel angles, functional variables are built to estimate peeling processes of biomimetic adhesive structure in various conditions. The results show that the maximum pull-off force is 12.25 N and pull-off force is decreasing in peeling process but the cohesive force immediate raise while the contact area becomes smaller. Stress concentration occurs both on the top and at base of the structure during the peeling process. The simulation results demonstrate that an optimal shape of adhesive structure can be achieved by examining the simulated pull-off forces. In order to avoid failure occurrence during the peeling process, the structure with a large base can decrease the stress concentrate at the bottom. Based on the analysis, the adhesive structure with an optimized half-hourglass shape is proposed.
Keywords :
adhesion; adhesives; biomimetics; condition monitoring; finite element analysis; COMSOL software; adhesion; biomimetic adhesive structure; cohesive stress; finite element method; molecular interaction; peeling condition analysis; pull-off force; van der Waals interaction; Adhesives; Biological system modeling; Force; Joints; Mathematical model; Stress; Substrates; biomimetic adhesive; finite element method; peeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location :
Xi´an
Type :
conf
DOI :
10.1109/NEMS.2015.7147471
Filename :
7147471
Link To Document :
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