Tentative bonding effect for maintaining alignment accuracy in bonding utilizing thick SU8 as an adhesive material

In this paper we have reported that a novel method to maintain alignment accuracy in wafer bonding process utilizing resin as an adhesive material. We have proposed tentatively localized bonding method with 1100 nm near infrared (NIR) irradiation that is transparent to Si wafers. With the aid of our localized tentative bonding process, we have achieved maintenance of alignment accuracy when the 100 μm thick SU8 was utilized as an adhesive resin material between Si wafers. Moreover, in this paper, we have also reported the development results of a tentative bonder, which has the function for alignment of wafers simultaneously.