DocumentCode :
718928
Title :
Numerical simulation of nickel electroforming process influenced by flow field
Author :
Hao Sun ; Xiang Wang
Author_Institution :
Dept. of Precision Machinery & Precision Instrum., Univ. of Sci. & Technol. of China, Hefei, China
fYear :
2015
fDate :
7-11 April 2015
Firstpage :
502
Lastpage :
506
Abstract :
A theoretical model of nickel electroforming within the patterned photo-resist microstructures is proposed. Fluid flow, transport of ion species and electrode reaction kinetics are fully coupled in this model to characterize the electroforming system. Numerical simulations of the electroforming process are carried out using a finite element method. By analyzing time variation of the reaction ions concentration distribution and evolution of the deposition surface, the effects of flow field on the electroforming process in microstructures of different aspect ratios are investigated.
Keywords :
electrodes; electroforming; finite element analysis; nickel; photoresists; reaction kinetics; Ni; deposition surface; electrode reaction kinetics; electroforming system; finite element method; flow field; fluid flow; ion species; nickel electroforming process; patterned photoresist microstructures; reaction ions concentration distribution; Cathodes; Fluid flow; Mathematical model; Microstructure; Nickel; Numerical models; Surface treatment; electroforming; flow field; moving boundary; numerical simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location :
Xi´an
Type :
conf
DOI :
10.1109/NEMS.2015.7147478
Filename :
7147478
Link To Document :
بازگشت