Numerical simulation of nickel electroforming process influenced by flow field

Author

Hao Sun ; Xiang Wang

Author_Institution

Dept. of Precision Machinery & Precision Instrum., Univ. of Sci. & Technol. of China, Hefei, China

fYear

2015

fDate

7-11 April 2015

Firstpage

502

Lastpage

506

Abstract

A theoretical model of nickel electroforming within the patterned photo-resist microstructures is proposed. Fluid flow, transport of ion species and electrode reaction kinetics are fully coupled in this model to characterize the electroforming system. Numerical simulations of the electroforming process are carried out using a finite element method. By analyzing time variation of the reaction ions concentration distribution and evolution of the deposition surface, the effects of flow field on the electroforming process in microstructures of different aspect ratios are investigated.

Keywords

electrodes; electroforming; finite element analysis; nickel; photoresists; reaction kinetics; Ni; deposition surface; electrode reaction kinetics; electroforming system; finite element method; flow field; fluid flow; ion species; nickel electroforming process; patterned photoresist microstructures; reaction ions concentration distribution; Cathodes; Fluid flow; Mathematical model; Microstructure; Nickel; Numerical models; Surface treatment; electroforming; flow field; moving boundary; numerical simulation;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on

Conference_Location

Xi´an

Type

conf

DOI

10.1109/NEMS.2015.7147478

Filename

7147478