• DocumentCode
    719922
  • Title

    Table of contents

  • Author

    Handel, Peter ; Skog, Isaac ; Ohlsson, Martin ; Ohlsson, Jens

  • Author_Institution
    Dept. of Signal Processing, R. Inst. of Technol. (KTH), Stockholm, Sweden
  • fYear
    2015
  • fDate
    11-14 May 2015
  • Abstract
    The following topics are dealt with: Insurance telematics is a disruptive technology that is expected to reform the vehicle insurance industry. Based on sensor data, the traditional measures for calculating the insurance premium are complemented to determine a fee that more accurately predicts the risk profile of the policyholder. From an instrumentation and measurement point of view, there are several insurance telematics challenges that have to be tackled. It is about consistently extracting relevant figures of merit (FoMs) like number of harsh braking, speeding, heavy cornering, trip smoothness, etc, and then to transform these FoMs into a valid measure, or score, that determines the risk profile of the insurance customer. The paper presents a characterization of FoMs in terms of actuarial relevance, the driver´s influence, stationarity and observability, which are important for the given task. Dedicated hardware to be fitted into the on-board diagnostics outlet as well as contemporary smartphones are two different insurance telematics platforms for data collection. The paper discusses the properties of the smartphone in the perspective of insurance telematics as a low-cost alternative to the hardwired platforms like the one connected to the vehicle´s on-board diagnostics outlet.
  • Keywords
    computerised instrumentation; insurance; mobile computing; smart phones; FoM; figures of merit; harsh braking; heavy cornering; insurance telematics platform; on-board diagnostics outlet; sensor data collection; smartphone instrumentation; trip smoothness; vehicle insurance industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference (I2MTC), 2015 IEEE International
  • Conference_Location
    Pisa
  • Type

    conf

  • DOI
    10.1109/I2MTC.2015.7151228
  • Filename
    7151228