• DocumentCode
    720091
  • Title

    Application of frequency selective surfaces for inspection of layered structures

  • Author

    Pieper, Dustin F. ; Donnell, Kristen M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • fYear
    2015
  • fDate
    11-14 May 2015
  • Firstpage
    1204
  • Lastpage
    1209
  • Abstract
    Structural health monitoring is important to many industries today. In the case of layered structures (such as composite structures found in the infrastructure and aerospace industries), one failure mechanism that is important to detect is that of delaminations. Numerous nondestructive testing (NDT) methods have been developed for this purpose including acoustic, thermography, microwave, etc. This paper presents a new application of frequency selective surfaces (FSS´s) as a potential inspection method for detection of delaminations in layered structures. Simulations and measurements are presented that support the potential of this method to serve as an additional NDT technique for layered structures. The results indicate that FSS´s are sensitive to delaminations occurring in the local vicinity of the FSS, but are less sensitive to delaminations occurring at other layer interfaces.
  • Keywords
    delamination; frequency selective surfaces; inspection; mechanical variables measurement; nondestructive testing; sensors; FSS; NDT method; aerospace industry; composite structure; delamination detection; failure mechanism; frequency selective surface; layered structure; nondestructive testing method; potential inspection method; structural health monitoring; Capacitance; Delamination; Dielectrics; Frequency selective surfaces; Monitoring; Reflection; Resonant frequency; composite materials; delamination; frequency selective surfaces; layered structures; metamaterials; nondestructive testing; remote monitoring; spatial filters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference (I2MTC), 2015 IEEE International
  • Conference_Location
    Pisa
  • Type

    conf

  • DOI
    10.1109/I2MTC.2015.7151444
  • Filename
    7151444