• DocumentCode
    720149
  • Title

    A common platform for bridging pre- and post-silicon verification in mixed-signal designs

  • Author

    Widhalm, Dominik ; Tauner, Stefan ; Horauer, Martin ; Schumacher, Achim ; Haggenmiller, Alexander

  • Author_Institution
    Univ. of Appl. Sci. Technikum Wien, Vienna, Austria
  • fYear
    2015
  • fDate
    11-14 May 2015
  • Firstpage
    1584
  • Lastpage
    1589
  • Abstract
    The steadily increasing complexity of integrated circuits raises the burden on verification engineers of sophisticated System on Chips (SoCs). Simulations and formal verification alone are not able to detect all problems in a design due to unforeseen interactions between modules. These problems may occur even if the modules are logically independent from each other due to physical effects. Bugs found in post-silicon verification in the laboratory on the other hand need to be investigated and fixed with the help of design engineers. Therefore, collaboration between pre- and post-silicon verification is mandatory, which also allows to exploit synergies. Unfortunately, many environments currently in use handle these activities almost in complete separation, which complicates cooperations. This paper introduces a new approach to improve the situation by using a common test description language for pre- and post-silicon verification. It allows to describe test cases to be run in simulation as well as in physical post-silicon environments.
  • Keywords
    elemental semiconductors; formal verification; integrated circuit design; mixed analogue-digital integrated circuits; silicon; system-on-chip; Si; SoC; bridging presilicon verification; design engineers; formal verification; integrated circuits; mixed-signal designs; post-silicon verification; system on chips; test description language; Computer bugs; Histograms; Instruments; Microcontrollers; Silicon; Software; Synchronization; Simulation; Test generation; Testability; Verification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference (I2MTC), 2015 IEEE International
  • Conference_Location
    Pisa
  • Type

    conf

  • DOI
    10.1109/I2MTC.2015.7151515
  • Filename
    7151515