• DocumentCode
    720764
  • Title

    Fabrication of 3D carbon structures based on C-MEMS technique (invited speaker)

  • Author

    Shulan Jiang ; Tielin Shi ; Hu Long ; Shuang Xi ; Hu Hao ; Siyi Cheng ; Zirong Tang

  • Author_Institution
    State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2015
  • fDate
    15-16 March 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Facile and low-cost strategies are devised for large-scale manufacturing of three-dimensional (3D) large surface area and high-aspect-ratio carbon structures using UV photolithography process along with pyrolysis process. Moreover, combined with self-assembly process, oxygen plasma etching process, film sputtering process, or electrochemically deposition process, various 3D large surface area carbon structures are obtained, including suspended glassy-like carbon microelectrodes, nanowrinkles integrated carbon microstructures, micro/nano dual-scale carbon array, etc. These large surface area carbon structures show great potentials in the fields of chemical and biological sensors, surface-enhanced Raman scattering, and energy storage devices such as micro-supercapacitors, micro-batteries and fuel cells. This paper provides an overview of our research on large-scale fabrication of 3D large surface area carbon structures.
  • Keywords
    microelectrodes; micromechanical devices; pyrolysis; self-assembly; sputter etching; ultraviolet lithography; 3D carbon structures; C-MEMS technique; UV photolithography process; dual-scale carbon array; electrochemically deposition process; film sputtering process; glassy-like carbon microelectrodes; nanowrinkles integrated carbon microstructures; oxygen plasma etching process; pyrolysis process; self-assembly process; Carbon; Fabrication; Films; Lithography; Plasmas; Resists; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Technology International Conference (CSTIC), 2015 China
  • Conference_Location
    Shanghai
  • ISSN
    2158-2297
  • Type

    conf

  • DOI
    10.1109/CSTIC.2015.7153349
  • Filename
    7153349