Title :
E150 advanced 150mm Reticle SMIF Pod
Author :
Huaping Wang ; Schmidt, Tim ; Wiseman, Brian ; Tieben, Tony
Author_Institution :
Entegris, Inc., Chaska, MN, USA
Abstract :
EUV Technology continues to make slow progress due to power source constraints. This extension will force customers to use 193 nm technology to bridge the gap until EUV can be fully utilized. As 193 nm technology are being used in smaller and smaller technology nodes, customers are imposing more and more stringent contamination requirements on the reticle environment to protect reticles from haze formation. Entegris´ new E150 advanced 150mm Reticle SMIF Pod (RSP) has been designed to achieve several important goals: 1) Maintaining low relative humidity (RH) level after purge by advanced seal design and material choice; 2) Allowing cleaning and drying without disassembly; 3) Excellent electrostatic protection of reticles; 4) Modular design to allow flexibility to meet specific customer needs and take advantage of new resin technology. This paper presents the modular design concept and the test results of the RH retention, dryability, and electrical performance of the E150 150mm RSP.
Keywords :
humidity; nanolithography; resins; reticles; ultraviolet lithography; EUV technology; Entegris E150; RH retention; RSP; advanced seal design; haze formation; power source constraint; relative humidity; resin technology; reticle SMIF pod; reticle electrostatic protection; size 193 nm; stringent contamination requirement; Antennas; Conductivity; Electrostatics; Force; Metals; Polymers; Seals;
Conference_Titel :
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location :
Shanghai
DOI :
10.1109/CSTIC.2015.7153362