Title :
Advanced process control applications for advanced CMP process
Author :
Jun Yang ; Yi Shih Lin ; Yang, SiYuan Frank ; Yi Huang ; Qun Shao ; Hongtao Liu
Author_Institution :
Semicond. Manuf. Int. (Shanghai) Corp., Shanghai, China
Abstract :
There are increasing new needs for advanced process control (APC) from chemical mechanical polishing (CMP) process along with the technology nodes advancing to 28nm and below. Besides traditional applications for wafer to wafer and batch to batch thickness variation reduction, and feed-forward based on incoming thickness/depth, the other new needs include within wafer uniformity control based on consumable counts and incoming profile, preventing polishing rate from dropping due to disk and pad deteriorating etc. This paper discusses those APC applications for CMP processes and along with important features which advanced APC software should equip with.
Keywords :
chemical mechanical polishing; process control; advanced APC software; advanced CMP process; advanced process control; chemical mechanical polishing; size 28 nm; thickness variation reduction; wafer uniformity control; Process control; Production; Radio access networks; Safety; Semiconductor device modeling; Software; Tuning; advanced process control; chemical mechanical polishing; partition; profile control; run to run control; safety guarding features;
Conference_Titel :
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location :
Shanghai
DOI :
10.1109/CSTIC.2015.7153421
