Advanced process control applications for advanced CMP process

Author

Jun Yang ; Yi Shih Lin ; Yang, SiYuan Frank ; Yi Huang ; Qun Shao ; Hongtao Liu

Author_Institution

Semicond. Manuf. Int. (Shanghai) Corp., Shanghai, China

fYear

2015

fDate

15-16 March 2015

Firstpage

1

Lastpage

3

Abstract

There are increasing new needs for advanced process control (APC) from chemical mechanical polishing (CMP) process along with the technology nodes advancing to 28nm and below. Besides traditional applications for wafer to wafer and batch to batch thickness variation reduction, and feed-forward based on incoming thickness/depth, the other new needs include within wafer uniformity control based on consumable counts and incoming profile, preventing polishing rate from dropping due to disk and pad deteriorating etc. This paper discusses those APC applications for CMP processes and along with important features which advanced APC software should equip with.

Keywords

chemical mechanical polishing; process control; advanced APC software; advanced CMP process; advanced process control; chemical mechanical polishing; size 28 nm; thickness variation reduction; wafer uniformity control; Process control; Production; Radio access networks; Safety; Semiconductor device modeling; Software; Tuning; advanced process control; chemical mechanical polishing; partition; profile control; run to run control; safety guarding features;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Technology International Conference (CSTIC), 2015 China

Conference_Location

Shanghai

ISSN

2158-2297

Type

conf

DOI

10.1109/CSTIC.2015.7153421

Filename

7153421