Universal copper clip packaging solution for power management IC

Copper Clip packaging solution is an advanced power management device packaging solution with a sheet of copper connecting the source pad (typically on MOSFET) to the lead frame or substrate for the purpose of reducing Rds(on) and improving electrical and thermal performance of the device. This paper covers the general design considerations of copper clip packaging, and explores new concepts to modify traditional copper clip design to cater for devices with different die sizes. Design FMEA and Design for Manufacturing (DFM) methodology was employed to explore various design options. Process characterization based on power management device manufacturing criteria was conducted to ensure the manufacturability of various options of design. The robustness of the new packaging solution was validated through electrical characterization of Rds(on) performance, and MSL preconditioning and reliability tests.