Finite element simulation for FPCB curing process

Author

Zheng Zhirong ; Kevin, Cui ; Ding Pingren

Author_Institution

Infineon Technol. (Wuxi) Co., Ltd., China

fYear

2015

fDate

15-16 March 2015

Firstpage

1

Lastpage

3

Abstract

The curing process of flip chip (FC) on flexible printed circuit boards (FPCB) was introduced. The structure of equipment was analyzed. The possible effect of equipment structure was evaluated. Different finite element analysis (FEA) models in different situations were built. Thermal influence parameters were verified for curing process by comparing FEA models and actual products. The parameters of transient FEA were defined after further analysis and were verified by use of transient FEA. The result of transient finite element simulation provided the theoretical evidence for the transient parameters setting. By comparing with actual parameters and the FEA results, curing process and optimized parameters by finite element thermal simulation were validated successfully.

Keywords

curing; finite element analysis; flexible electronics; flip-chip devices; printed circuits; FC; FPCB curing process; finite element thermal simulation; flexible printed circuit boards; flip chip; thermal influence parameter; transient FEA model; Gold; Heating; Plastics; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Technology International Conference (CSTIC), 2015 China

Conference_Location

Shanghai

ISSN

2158-2297

Type

conf

DOI

10.1109/CSTIC.2015.7153442

Filename

7153442