Novel crosstalk minimization code for 3D IC

Author

Yifan Zhang ; Binbin Li ; Bolun Zhang ; Dongmei Xue

Author_Institution

ShenZhen Grad. Sch., Peking Univ., Shenzhen, China

fYear

2015

fDate

15-16 March 2015

Firstpage

1

Lastpage

3

Abstract

3D integration with through-silicon-vias(TSVs) is a promising way in circuit design. Due to the large dimensions and the tight space of TSVs, signal transmission and integrity face severe challenge from the capacitive crosstalk of TSVs. This paper proposes a 3*3 TSVs modified Fibonacci based Binary Numeral System (FNS) applied to 3*N mesh to reduce the worst crosstalk delay. Partial encoding which means 9-bit Fibonacci code represent 6-bit binary code is applied to the coding and decoding circuit to make the area overhead lower. The experiment shows that the proposed coding scheme can decrease 31% crosstalk delay time compared with the uncoded situation.

Keywords

Fibonacci sequences; binary codes; crosstalk; integrated circuit design; three-dimensional integrated circuits; 3D IC; Fibonacci based binary numeral system; TSV; binary code; capacitive crosstalk; crosstalk delay; crosstalk minimization code; decoding circuit; partial encoding; storage capacity 6 bit; storage capacity 9 bit; through-silicon-vias; Analytical models; Crosstalk; Encoding; Three-dimensional displays; Through-silicon vias; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Technology International Conference (CSTIC), 2015 China

Conference_Location

Shanghai

ISSN

2158-2297

Type

conf

DOI

10.1109/CSTIC.2015.7153459

Filename

7153459