Academic approach to new industry-relevant MEMS

Author

Tanaka, Shuji

Author_Institution

Dept. of Bioeng. & Robot., Tohoku Univ., Sendai, Japan

fYear

2015

fDate

15-16 March 2015

Firstpage

1

Lastpage

4

Abstract

The paper introduces recent collaboration between Tohoku University and industry in MEMS (micro electro mechanical systems) field. The selected examples of devices are an integrated network tactile sensor for robot applications, a tunable SAW (surface acoustic wave) filter for TV white space cognitive WiFi communication and an anodically-bondable LTCC (low temperature cofired ceramic) wafer for wafer-level hermetic MEMS packaging. In the last part of this paper, multi-leveled shared MEMS facilities available for industrial collaboration are summarized. The most important message here is that we are strongly motivated to contribute to industry in multiple manners.

Keywords

micromechanical devices; research and development; TV white space cognitive WiFi communication; anodically-bondable LTCC; integrated network tactile sensor; low temperature cofired ceramic wafer; micro electro mechanical systems; robot applications; surface acoustic wave filter; tunable SAW filter; wafer-level hermetic MEMS packaging; Collaboration; Gold; Industries; Micromechanical devices; Tactile sensors; Varactors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Technology International Conference (CSTIC), 2015 China

Conference_Location

Shanghai

ISSN

2158-2297

Type

conf

DOI

10.1109/CSTIC.2015.7153479

Filename

7153479