DocumentCode
720870
Title
Table of contents
fYear
2015
fDate
15-16 March 2015
Firstpage
1
Lastpage
20
Abstract
The following topics are dealt with: device engineering; lithography; etching; thin film technology; CMP; process integration; interconnects; packaging; metrology; testing; MEMS; circuit design; and photovoltaic technology.
Keywords
chemical mechanical polishing; circuit testing; electronics packaging; etching; integrated circuit interconnections; lithography; measurement; micromechanical devices; network synthesis; semiconductor thin films; solar cells; CMP; MEMS; chemical mechanical polishing; circuit design; device engineering; etching; interconnect; lithography; metrology; microelectromechanical system; packaging; photovoltaic technology; process integration; testing; thin film technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location
Shanghai
ISSN
2158-2297
Type
conf
DOI
10.1109/CSTIC.2015.7153499
Filename
7153499
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