Title :
Table of contents
Abstract :
The following topics are dealt with: device engineering; lithography; etching; thin film technology; CMP; process integration; interconnects; packaging; metrology; testing; MEMS; circuit design; and photovoltaic technology.
Keywords :
chemical mechanical polishing; circuit testing; electronics packaging; etching; integrated circuit interconnections; lithography; measurement; micromechanical devices; network synthesis; semiconductor thin films; solar cells; CMP; MEMS; chemical mechanical polishing; circuit design; device engineering; etching; interconnect; lithography; metrology; microelectromechanical system; packaging; photovoltaic technology; process integration; testing; thin film technology;
Conference_Titel :
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location :
Shanghai
DOI :
10.1109/CSTIC.2015.7153499
