• DocumentCode
    721
  • Title

    Orientation Imaging Microscopy With Optimized Convergence Angle Using CBED Patterns in TEMs

  • Author

    Kumar, Vipin

  • Author_Institution
    Metall. Eng., Univ. of Utah, Salt Lake City, UT, USA
  • Volume
    22
  • Issue
    7
  • fYear
    2013
  • fDate
    Jul-13
  • Firstpage
    2637
  • Lastpage
    2645
  • Abstract
    Grain size statistics, texture, and grain boundary distribution are microstructural characteristics that greatly influence materials properties. These characteristics can be derived from an orientation map obtained using orientation imaging microscopy (OIM) techniques. The OIM techniques are generally performed using a transmission electron microscopy (TEM) for nanomaterials. Although some of these techniques have limited applicability in certain situations, others have limited availability because of external hardware required. In this paper, an automated method to generate orientation maps using convergence beam electron diffraction patterns obtained in a conventional TEM setup is presented. This method is based upon dynamical diffraction theory that describes electron diffraction more accurately as compared with kinematical theory used by several existing OIM techniques. In addition, the method of this paper uses wide angle convergent beam electron diffraction for performing OIM. It is shown in this paper that the use of the wide angle convergent electron beam provides additional information that is not available otherwise. Together, the presented method exploits the additional information and combines it with the calculations from the dynamical theory to provide accurate orientation maps in a conventional TEM setup. The automated method of this paper is applied to a platinum thin film sample. The presented method correctly identified the texture preference in the sample.
  • Keywords
    convergence; electron diffraction; grain boundaries; grain size; image recognition; texture; transmission electron microscopy; CBED patterns; OIM techniques; TEM; automated method; conventional TEM setup; convergence angle; convergence beam electron diffraction patterns; dynamical diffraction theory; grain boundary distribution; grain size statistics; materials properties; microstructural characteristics; nanomaterials; orientation imaging microscopy; platinum thin film sample; texture; transmission electron microscopy; wide angle convergent electron beam; Convergent beam electron diffraction (CBED); dynamical diffraction theory; orientation imaging microscopy (OIM); transmission electron microscopy (TEM);
  • fLanguage
    English
  • Journal_Title
    Image Processing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1057-7149
  • Type

    jour

  • DOI
    10.1109/TIP.2013.2255299
  • Filename
    6490053