Title :
Magnetometry-based order parameter to probe the A1 to L10 transformation in FeCuPt for heat-assisted magnetic recording media
Author :
Gilbert, D.A. ; Liao, J. ; Wang, L. ; Lau, J.W. ; Klemmer, T.J. ; Thiele, J. ; Lai, C. ; Liu, K.
Author_Institution :
Phys. Dept., U.C. Davis, Davis, CA, USA
Abstract :
High magnetic anisotropy materials such as L10 FePt alloys are particularly sought after for the emerging heat-assisted magnetic recording (HAMR) media. A critical challenge has been the elevated annealing temperature (typically above 6000C) necessary to transform the as-deposited cubic A1 phase into the ordered L10 phase, which is often incompatible with the rest of the manufacturing processes. Another key issue is the stringent requirement on switching field distribution for ultrahigh density HAMR media, where residual A1 phase could be detrimental. Therefore, a complete understanding of the low anisotropy A1 to high anisotropy L10 phase transformation is critical. In prior studies, an order parameter S is often used to characterize the degree of the L10 ordering, using properly corrected, integrated intensities of the x-ray diffraction (XRD) peaks, since differences in lattice occupation are manifested in the structure factor. This is an elaborate, time consuming process, yet its applicability still has significant limitations, e.g., for textured samples or materials with poor crystallinity, and for samples with tiny amount of minority phases.
Keywords :
X-ray diffraction; copper alloys; iron alloys; magnetic recording; platinum alloys; rapid thermal annealing; solid-state phase transformations; A1 to L10 phase transformation; FeCuPt; X-ray diffraction; XRD; annealing temperature; cubic A1 phase; heat-assisted magnetic recording media; high magnetic anisotropy materials; lattice occupation; magnetometry-based order parameter; ordered L10 phase; structure factor; Anisotropic magnetoresistance; Films; Heat-assisted magnetic recording; Media; Perpendicular magnetic anisotropy;
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
DOI :
10.1109/INTMAG.2015.7156496