• DocumentCode
    721681
  • Title

    Magnetic and magnetotransport properties of bi-component arrays of magnetic dots by self-assembling of polystyrene nanospheres

  • Author

    Tiberto, P. ; Barrera, G. ; Celegato, F. ; Coisson, M. ; Vinai, F.

  • Author_Institution
    Electromagn., INRIM, Turin, Italy
  • fYear
    2015
  • fDate
    11-15 May 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    In this context, antidot structures in which the holes are filled with another ferromagnetic material emerged of interest in magnonic applications for unique static and dynamic properties. In this context, the static behaviors of magnetic hysteresis and magnetotransport response have been investigated in Ni80Fe20 antidot filled with Co nanostructures . A modification in the magnetic behavior and magnetotransport properties is observed in bi-component sample with respect to the constituting systems and can be ascribed the coupling between the two ferromagnetic materials . To synthesize such a bi-component material, a continuous Co layer having thickness ranging in the interval 20-40 nm has been deposited by sputtering on a Si/SiO2 substrate.
  • Keywords
    cobalt alloys; ferromagnetic materials; filled polymers; galvanomagnetic effects; iron alloys; magnetic hysteresis; magnons; nanocomposites; nanofabrication; nanolithography; nanopatterning; nickel alloys; self-assembly; sputter deposition; Ni80Fe20Co; Si-SiO2 substrate; SiO2-Si; antidot structures; bicomponent arrays; bicomponent material; dynamic properties; ferromagnetic material; magnetic dots; magnetic hysteresis; magnetic properties; magnetotransport properties; magnonic applications; nanostructures; polystyrene nanospheres; self-assembly; size 20 nm to 40 nm; sputtering deposition; static properties; Magnetic field measurement; Magnetic hysteresis; Magnetic multilayers; Magnetic resonance imaging; Magnetometers; Perpendicular magnetic anisotropy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference (INTERMAG), 2015 IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-7321-7
  • Type

    conf

  • DOI
    10.1109/INTMAG.2015.7156879
  • Filename
    7156879