DocumentCode
721918
Title
The effect of spin pumping in epitaxial Bi2 Se3 films
Author
Chiang, T. ; Lee, J. ; Tai, P. ; Wang, Z. ; Yi, T. ; Lee, S. ; Huang, J.
Author_Institution
Dept. of Phys., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2015
fDate
11-15 May 2015
Firstpage
1
Lastpage
1
Abstract
Bi2Se3 is one of the promising topological insulator (TI) materials, which have both helical spin polarization and strong spin-orbit coupling (SOC). In this work, high quality Bi2Se3 thin films were grown on c-plane sapphire (Al2O3) substrates by molecular beam epitaxy (MBE). The central part of the Bi2Se3 layer was covered with a permalloy (Ni80Fe20) layer by ion-beam sputtering (IBS) with a shadow mask. The inverse spin Hall effect (ISHE) of Bi2Se3/Py bilayers have been observed by spin pumping method at room temperature (RT). The magnitude of the electric voltage is proportional to the microwave excitation power and the direction of voltage is reversed when the direction of external magnetic field is reversed, proving that the voltage is due to ISHE induced by the spin pumping. Moreover, when the thickness of Bi2Se3 is equal to 8nm, the ISHE voltage has the maximum, evaluating the spin-diffusion length of Bi2Se3 is about 8nm.
Keywords
Permalloy; bismuth compounds; epitaxial layers; molecular beam epitaxial growth; spin Hall effect; spin polarised transport; spin-orbit interactions; topological insulators; Al2O3; Bi2Se3-Ni80Fe20; MBE; c-plane sapphire substrates; electric voltage; epitaxial Bi2Se3 films; external magnetic field direction; helical spin polarization; inverse spin Hall effect; ion-beam sputtering; microwave excitation power; molecular beam epitaxy; permalloy layer; shadow mask; spin pumping effect; spin-orbit coupling; temperature 293 K to 298 K; topological insulator materials; Cities and towns; Magnetic fields; Microwave frequencies; Microwave theory and techniques; Molecular beam epitaxial growth; Physics; Topological insulators;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4799-7321-7
Type
conf
DOI
10.1109/INTMAG.2015.7157177
Filename
7157177
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