Title :
Dual-peak self-biased magnetoelectric couplings in symmetrical multiferroic heterostructures
Author :
Zhang, J. ; Wang, X. ; Yang, Q. ; Zheng, X. ; Cao, L.
Author_Institution :
Dept. of Smart Grids & Inf. Eng., Zhengzhou Univ. of Light Ind., Zhengzhou, China
Abstract :
In this study, the results of an investigation of dual-peak resonance ME couplings at zero magnetic bias in a symmetric ME heterostructure consisting of two distinct ferromagnetic layers Terfenol-D and SmFe2 plates placed between piezoelectric plate PZT-5H is presented, and the magnetostrictive layers with positive and negative magnetostrictions. A negative shear force as well as large internal anisotropic field is provided by SmFe2 plate due to its ferromagnetic and magnetostrictive properties, and the Terfenol-D plate provides a positive shear force to provoke a higher shear-stress transfer. In this architecture the SmFe2 plate plays two key roles: (i) it serves as piezomagnetic phase providing a negative shear force; (ii) it can provide an internal field to bias the ME composite due to its ferromagnetism with obvious hysteresis and large remnant magnetostriction oriented the direction [111] of easy-magnetization axis.
Keywords :
ferromagnetic materials; interface magnetism; iron alloys; magnetisation; magnetoelectric effects; magnetostriction; multiferroics; samarium alloys; SmFe2; Terfenol-D plate; dual-peak self-biased magnetoelectric couplings; easy-magnetization axis [111] direction; ferromagnetic layers; internal anisotropic field; internal field; magnetostrictive layers; negative magnetostriction; negative shear force; piezoelectric plate PZT-5H; piezomagnetic phase; positive magnetostriction; positive shear force; remnant magnetostriction; shear-stress transfer; symmetric magnetoelectric heterostructure; symmetrical multiferroic heterostructures; Amorphous magnetic materials; Magnetic hysteresis; Magnetic resonance; Magnetoelectric effects; Magnetostriction; Perpendicular magnetic anisotropy;
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
DOI :
10.1109/INTMAG.2015.7157317