Title :
Three-terminal spintronics memory devices with perpendicular anisotropy
Author :
Ohno, H. ; Fukami, S.
Author_Institution :
Lab. for Nanoelectron. & Spintronics, Tohoku Univ., Sendai, Japan
Abstract :
The focus of spintronics memory device that constitutes MRAM has so far been largely on two-terminal magnetic tunnel junction with spin-transfer torque magnetization switching, because of its superior area efficiency . In a number of cases, however, where switching speed and relaxed control of parameters are more preferred than the reduced area, three-terminal spintronics device is an equally, if not more, attractive alternative . Here “three-terminal” refers to the number of terminals used for read and write operations . This configuration allows realizing high-speed and high-reliability device operation, suitable for replacement of semiconductor-based working memories such as SRAMs but with nonvolatility and reduced area to overcome issues of scaling limit and increasing power consumption. Two types of three-terminal devices are currently under development; one utilizes a current-induced domain wall (DW) motion and the other a spin-orbit torque (SOT) induced magnetization switching for their write operation . Here we review and compare their basic operation principles and the technological prospects .
Keywords :
MRAM devices; magnetic domain walls; magnetic switching; magnetic tunnelling; magnetisation; magnetoelectronics; perpendicular magnetic anisotropy; torque; MRAM; current-induced domain wall motion; high-reliability device operation; high-speed device operation; magnetic tunnel junction; perpendicular anisotropy; power consumption; read-write operations; spin-orbit torque induced magnetization switching; spin-transfer torque magnetization switching; spintronic memory devices; three-terminal spintronics device; Anisotropic magnetoresistance; Critical current density (superconductivity); Magnetization; Magnetoelectronics; Switches; Thermal stability; Torque;
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
DOI :
10.1109/INTMAG.2015.7157427