• DocumentCode
    72277
  • Title

    Welcome to EMBC 2013 in Osaka [Guest Editorial]

  • Author

    Sunagawa, K.

  • Volume
    4
  • Issue
    3
  • fYear
    2013
  • fDate
    May-13
  • Firstpage
    10
  • Lastpage
    10
  • Abstract
    Presents an opening message from the 2013 IEEE Engineering in Medicine and Biology Conference that will be held in Osaka, Japan.
  • Keywords
    Biomedical engineering; Meetings; Special issues and sections;
  • fLanguage
    English
  • Journal_Title
    Pulse, IEEE
  • Publisher
    ieee
  • ISSN
    2154-2287
  • Type

    jour

  • DOI
    10.1109/MPUL.2013.2250839
  • Filename
    6518156
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=72277