DocumentCode
722793
Title
Message from the organizing committee chair
Author
Kobayashi, Hiroaki
Author_Institution
Tohoku University, Japan
fYear
2015
fDate
13-15 April 2015
Abstract
It is my pleasure to welcome you to the COOL Chips XVIII, the 18th IEEE Symposium on Low-Power and High-Speed Chips. COOL Chips Conference Series started in 1998, which was held in Tokyo as a one-day event of invited talks only. Now COOL Chips is a three-day event fully sponsored by IEEE Computer Society, which covers not only the chip architecture design, but also software technologies at system software and application levels.
Keywords
Media;
fLanguage
English
Publisher
ieee
Conference_Titel
Low-Power and High-Speed Chips (COOL CHIPS XVIII), 2015 IEEE Symposium in
Conference_Location
Yokohama, Japan
Type
conf
DOI
10.1109/CoolChips.2015.7158524
Filename
7158524
Link To Document