• DocumentCode
    722803
  • Title

    High breakdown voltage AlGaN/GaN HEMTs on free-standing GaN substrate

  • Author

    Ng, J.H. ; Tone, K. ; Asubar, J.T. ; Tokuda, H. ; Kuzuhara, M.

  • Author_Institution
    Grad. Sch. of Eng., Univ. of Fukui, Fukui, Japan
  • fYear
    2015
  • fDate
    4-5 June 2015
  • Firstpage
    54
  • Lastpage
    55
  • Abstract
    In this paper we have investigated the relationship between off-state breakdown voltage and gate-to-drain distance (Lgd) for AlGaN/GaN HEMTs fabricated on a free-standing GaN substrate. The off-state breakdown voltage exhibited a linear increase up to Lgd of around 80 μm but saturated at about 4000 V when Lgd > 80 μm. Therefore, we proposed that when Lgd <; 80 μm, the breakdown voltage of HEMTs was dominated by leakage current under the channel and when Lgd > 80 μm, it was determined by the leakage current outside of the channel.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; wide band gap semiconductors; AlGaN-GaN; AlGaN-GaN HEMT; GaN; free-standing GaN substrate; gate-to-drain distance; leakage current; off-state breakdown voltage; Aluminum gallium nitride; Electric breakdown; Gallium nitride; HEMTs; MODFETs; Substrates; Wide band gap semiconductors; AlGaN/GaN; Breakdown Voltage; Free-Standing GaN Substrate; HEMT;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, Kansai (IMFEDK), 2015 IEEE International Meeting for
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-8614-9
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2015.7158546
  • Filename
    7158546