DocumentCode :
722803
Title :
High breakdown voltage AlGaN/GaN HEMTs on free-standing GaN substrate
Author :
Ng, J.H. ; Tone, K. ; Asubar, J.T. ; Tokuda, H. ; Kuzuhara, M.
Author_Institution :
Grad. Sch. of Eng., Univ. of Fukui, Fukui, Japan
fYear :
2015
fDate :
4-5 June 2015
Firstpage :
54
Lastpage :
55
Abstract :
In this paper we have investigated the relationship between off-state breakdown voltage and gate-to-drain distance (Lgd) for AlGaN/GaN HEMTs fabricated on a free-standing GaN substrate. The off-state breakdown voltage exhibited a linear increase up to Lgd of around 80 μm but saturated at about 4000 V when Lgd > 80 μm. Therefore, we proposed that when Lgd <; 80 μm, the breakdown voltage of HEMTs was dominated by leakage current under the channel and when Lgd > 80 μm, it was determined by the leakage current outside of the channel.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; wide band gap semiconductors; AlGaN-GaN; AlGaN-GaN HEMT; GaN; free-standing GaN substrate; gate-to-drain distance; leakage current; off-state breakdown voltage; Aluminum gallium nitride; Electric breakdown; Gallium nitride; HEMTs; MODFETs; Substrates; Wide band gap semiconductors; AlGaN/GaN; Breakdown Voltage; Free-Standing GaN Substrate; HEMT;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, Kansai (IMFEDK), 2015 IEEE International Meeting for
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-8614-9
Type :
conf
DOI :
10.1109/IMFEDK.2015.7158546
Filename :
7158546
Link To Document :
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