DocumentCode :
722822
Title :
Evolution of nanoscale silicon CMOS technology for ultra low power application
Author :
Matsukawa, T. ; Morita, Y. ; Mori, T. ; Liu, Y.X. ; O´uchi, S. ; Migita, S. ; Masahara, M.
Author_Institution :
Nanoelectron. Res. Inst., Nat. Inst. of Adv. Sci. & Technol. (AIST), Tsukuba, Japan
fYear :
2015
fDate :
4-5 June 2015
Firstpage :
102
Lastpage :
103
Abstract :
Nanoscale silicon CMOS technology aimed for ultra low power application is presented. The characteristics variability and noise of FinFETs are dramatically suppressed by introducing an amorphous metal gate, and the suppression is beneficial both for scaling and reduction of power consumption. A tunnel FET (TFET) is also promising candidate to reduce the power consumption dramatically. The current drivability of a silicon TFET is improved significantly by introduction of a fin-type 3D structure and novel trap engineering.
Keywords :
CMOS integrated circuits; MOSFET; elemental semiconductors; field effect transistor circuits; low-power electronics; silicon; FinFET noise; Si; amorphous metal gate; characteristics variability; fin-type 3D structure; nanoscale silicon CMOS technology; power consumption reduction; power consumption scaling; silicon TFET; trap engineering; ultra low power application; CMOS integrated circuits; CMOS technology; FinFETs; Metals; Silicon; Very large scale integration; FinFET; isoelectron trap; low frequency noise; tunnel FET; variavility;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, Kansai (IMFEDK), 2015 IEEE International Meeting for
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-8614-9
Type :
conf
DOI :
10.1109/IMFEDK.2015.7158570
Filename :
7158570
Link To Document :
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