Fined-grained body biasing for frequency scaling in advanced SOI processes

Author

Kuhn, Johannes Maximilian ; Amano, Hideharu ; Bringmann, Oliver ; Rosenstiel, Wolfgang

Author_Institution

Comput. Eng., Univ. of Tubingen, Tubingen, Germany

fYear

2015

fDate

13-15 April 2015

Firstpage

1

Lastpage

3

Abstract

New SOI processes offer unprecedented flexibility in regard to low-power and performance. The use of fine-grained body biasing in STMicro´s 28nm UTBB-FDSOI is evaluated for a Dynamically Reconfigurable Processor design in a frequency scaling scenario. Three different strategies are evaluated for Processing Elements: Static, programmable and dynamic body biasing. Fine-grained body biasing significantly mitigates increased leakage currents of forward body biasing between 42.85% to 64.5% on average. This makes static body biasing a viable low-cost option and makes dynamic body biasing worthwhile even at short time periods.

Keywords

integrated circuit design; low-power electronics; silicon-on-insulator; UTBB-FDSOI; advanced SOI processes; dynamic body biasing; dynamically reconfigurable processor design; fined grained body biasing; frequency scaling; Arrays; Clocks; Leakage currents; Radio frequency; Switches; Timing; Transistors; Body Biasing; Fine-Grained Power Management; Reconfigurable Architectures; SOI;

fLanguage

English

Publisher

ieee

Conference_Titel

Low-Power and High-Speed Chips (COOL CHIPS XVIII), 2015 IEEE Symposium in

Conference_Location

Yokohama

Type

conf

DOI

10.1109/CoolChips.2015.7158655

Filename

7158655