DocumentCode :
722858
Title :
Fined-grained body biasing for frequency scaling in advanced SOI processes
Author :
Kuhn, Johannes Maximilian ; Amano, Hideharu ; Bringmann, Oliver ; Rosenstiel, Wolfgang
Author_Institution :
Comput. Eng., Univ. of Tubingen, Tubingen, Germany
fYear :
2015
fDate :
13-15 April 2015
Firstpage :
1
Lastpage :
3
Abstract :
New SOI processes offer unprecedented flexibility in regard to low-power and performance. The use of fine-grained body biasing in STMicro´s 28nm UTBB-FDSOI is evaluated for a Dynamically Reconfigurable Processor design in a frequency scaling scenario. Three different strategies are evaluated for Processing Elements: Static, programmable and dynamic body biasing. Fine-grained body biasing significantly mitigates increased leakage currents of forward body biasing between 42.85% to 64.5% on average. This makes static body biasing a viable low-cost option and makes dynamic body biasing worthwhile even at short time periods.
Keywords :
integrated circuit design; low-power electronics; silicon-on-insulator; UTBB-FDSOI; advanced SOI processes; dynamic body biasing; dynamically reconfigurable processor design; fined grained body biasing; frequency scaling; Arrays; Clocks; Leakage currents; Radio frequency; Switches; Timing; Transistors; Body Biasing; Fine-Grained Power Management; Reconfigurable Architectures; SOI;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Low-Power and High-Speed Chips (COOL CHIPS XVIII), 2015 IEEE Symposium in
Conference_Location :
Yokohama
Type :
conf
DOI :
10.1109/CoolChips.2015.7158655
Filename :
7158655
Link To Document :
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